Shenzhen Mincom Technic Co.,Ltd
PCB/PCBA/Materials Procurement/Solutions

MINCOM - Standard PCB
Feature 2017
Standard Advanced
Materials Shengyi FR-4/Kingboard CEM-1/aluminum FR-4 HF Ceramic filled high frequency board PTFE high frequency board Special PP Rigid PI Metal PCB
Layer 1050 x 610 FR-4 HDI Rigid-Flexible High-frequency Multilayer PTFE Metal Core Board
Maximum board size (mm) 1050 x 610 1400 x 610
Minimum board thickness (mm) 2L 0.15 0.15 for
Minimum board thickness (mm) ≥4L 0.25 0.25
Maximum board thickness (mm) 8.6 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF
Layer to layer registration 0.05mm 25μm
Minimum hole (mech) (mm/mil) 0.15mm 0.1mm
Minimum hole (laser) (mm/mil) 0.075 0,05
Aspect ratio PTH 15:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant)
Finish hole tolerance (PTH) ± 0.076mm ± 0.05mm
Finish hole tolerance (NPTH) ±0.0375 ±0.025
Maximum Cu weight OL 12oz 12oz
Maximum Cu weight IL 12oz 12oz
Controlled impedance (+/- X%) Others ± 10% ± 5%
Rigid-flex (Y/N) Y Y including semi flex
Flexible (Y/N) Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu)
Embedded components (Y/N) Y Y
Soldermask via plugging IPC4761 Type VI (Y/N) Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y